USPatentGranted
S1

Headphone

Granted 6 Aug 2024 · no office action yet

Current assignee: Shenzhen Bokaize Technology Co. Ltd. · originally Shenzhen Weibo Technology Co., Ltd

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Attorney: Attorney · Log in to unlock

Inventors: Wei Chen · Examiner: Jack Reickel · AU 2925 · TC 2900

Application
29/939,215
filed 25 Apr 2024
Publication
Not published
not published
Patent· this page
US D1038068
granted 6 Aug 2024

Life of the patent

5 dated events
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Description

1 parts
›FIG. 1 is a front, top perspective view…

FIG. 1 is a front, top perspective view of a headphone, showing my new design;

FIG. 2 is a rear, bottom perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is another perspective view of the headphone, shown in an alternative position.

The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D14/206

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File wrapper

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Pendency
0.3 y
103 days filing → grant
Office actions
0
none on record
Examiner
Jack Reickel
art unit 2925 · TC 2900
Citations: 21 back · 5 forward

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Chain of title

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Term & fees

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Validity challenges

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Citations

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