USPatentGranted
S1

Mainframe of dual-robot substrate processing system

Granted 28 May 2024 · no office action yet

Current assignee: Applied Materials Israel · originally Applied Materials, Inc.

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Inventors: Michael R. Rice, Michael C. Kuchar, Travis Morey, Ofer Amir +1 · Examiner: Patricia A Palasik · AU 2918 · TC 2900

Application
29/830,396
filed 11 Mar 2022
Publication
Not published
not published
Patent· this page
US D1029066
granted 28 May 2024

Life of the patent

2 dated events
⤢ drag to zoomApr 2022Jul 2022Oct 2022Jan 2023Apr 2023Jul 2023Oct 2023Jan 2024Apr 2024Jul 2024Prosecution
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Description

1 parts
›FIG. 1 is a front, top perspective view…

FIG. 1 is a front, top perspective view of a mainframe for a dual-robot substrate processing system in accordance with the present design.

FIG. 2 is a left side elevational view of the present design.

FIG. 3 is a right side elevational view of the present design.

FIG. 4 is a front elevational view of the present design.

FIG. 5 is a rear elevational view of the present design.

FIG. 6 is a top plan view of the present design.

FIG. 7 is a bottom plan view of the second embodiment of the present design; and,

FIG. 8 is a front, top perspective view of the present design, showing unclaimed components attached thereto.

The broken lines shown in the figures are directed to unclaimed portions of the mainframe and/or unclaimed components attached to the mainframe that are for illustrative purposes only and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

2 codes
USPC · US Patent Classification
D15/141D15/138

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File wrapper

Pendency
2.2 y
809 days filing → grant
Office actions
0
none on record
Examiner
Patricia A Palasik
art unit 2918 · TC 2900
Citations: 33 back · 4 forward

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Chain of title

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Citations

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