USPatentGranted
S1

Bond pattern for substrate

Granted 20 Dec 2022 · no office action yet

Application
29/807,499
filed 13 Sep 2021
Publication
Not published
not published
Patent· this page
US D973200
granted 20 Dec 2022

Life of the patent

3 dated events
⤢ drag to zoomJan 2019Jul 2019Jan 2020Jul 2020Jan 2021Jul 2021Jan 2022Jul 2022Jan 2023Prosecution
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Description

1 parts
›FIG. 1 is a perspective view of a…

FIG. 1 is a perspective view of a bond pattern for a substrate;

FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1 ;

FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1 ;

FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1 ;

FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1 ;

FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1 ; and,

FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1 .

The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D24/126

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File wrapper

Pendency
1.3 y
463 days filing → grant
Office actions
0
after a restriction
Examiner
Samantha Q Lawrence
art unit 2921 · TC 2900
Citations: 83 back · 0 forward

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Chain of title

⤢ drag to zoom20222024202620282030203220342036203820402042Owner 1
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Priority chain

1 priority documents
Priority
17 Dec 2018
earliest claimed
›Priority documents — 1
TypeDocumentDate
provisionalUS 6278052017 Dec 2018

Worldwide family

16 members · 5 offices
US7EP2JP2CN4WO1
this patentIP5 & PCTother officessolid = grantedhover for detail · click to open
Members
16
DOCDB simple family 65995897
Offices
5
US · EP · JP · CN · WO
Granted
9 of 16
grant date present
Non-English titles
7
shown as filed, never translated
›IP5 & PCT — 16 members
OfficePublicationKindPublishedFiledStatusTitle
USUS-2019290504-A1A126 Sep 201919 Mar 2019publishedBond pattern
USthis patentUS-D973200-SS120 Dec 202213 Sep 2021grantedBond pattern for substrate
USUS-11642255-B2B29 May 202319 Mar 2019grantedBond pattern
USUS-2023233384-A1A127 Jul 202329 Mar 2023publishedBond pattern
USUS-11986379-B2B221 May 202429 Mar 2023grantedBond pattern
USUS-D1031026-SS111 Jun 20248 Nov 2022grantedBond pattern for substrate
USUS-D1076074-SS120 May 202518 Apr 2024grantedBond pattern for substrate
EPEP-3768208-A1A127 Jan 202119 Mar 2019publishedMotif de liaison dans un article absorbantfr
EPEP-3768208-B1B127 Mar 202419 Mar 2019grantedBindungsstruktur in einem absorbierenden artikelde
JPJP-2021516572-AA8 Jul 202119 Mar 2019published吸収性物品における結合パターンja
JPJP-7195332-B2B223 Dec 202219 Mar 2019granted吸収性物品における結合パターンja
CNCN-111727026-AA29 Sep 202019 Mar 2019published吸收制品中的粘结图案zh
CNCN-111727026-BB31 May 202219 Mar 2019grantedBond patterns in absorbent articles
CNCN-114848303-AA5 Aug 202219 Mar 2019publishedBond patterns in absorbent articles
CNCN-114848303-BB8 Mar 202419 Mar 2019granted吸收制品中的粘结图案zh
WOWO-2019183041-A1A126 Sep 201919 Mar 2019publishedMotif de liaison dans un article absorbantfr

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