FIG. 1 is an enlarged top isometric view of a deposition ring for a substrate processing chamber, according to the first embodiment of the novel design.

FIG. 2 is a top plan view thereof.

FIG. 3 is a bottom plan view thereof.

FIG. 4 is a front elevation view thereof.

FIG. 5 is a back elevation view thereof.

FIG. 6 is a left side elevation view thereof.

FIG. 7 is a right side elevation view thereof.

FIG. 8 is a cross-sectional view taken along line 8 - 8 in FIG. 2 , enlarged for clarity.

FIG. 9 is an enlarged top isometric view of a deposition ring for a substrate processing chamber, according to the second embodiment of the novel design.

FIG. 10 is a top plan view thereof.

FIG. 11 is a bottom plan view thereof.

FIG. 12 is a front elevation view thereof.

FIG. 13 is a back elevation view thereof.

FIG. 14 is a left side elevation view thereof.

FIG. 15 is a right side elevation view thereof; and,

FIG. 16 is a cross-sectional view taken along line 16 - 16 in FIG. 10 , enlarged for clarity.

The dashed lines in FIGS. 1-8 represent unclaimed environment forming no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a deposition ring for a substrate processing chamber, as shown and described.

Classifications

2 codes

USPC · US Patent Classification

D15/138D13/182

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Pendency

2.7 y

984 days filing → grant

Office actions

none on record

Examiner

Sheryl Lane

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3 members · 2 offices

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Office	Publication	Kind	Published	Filed	Status	Title
USthis patent	US-D933725-S	S1	19 Oct 2021	8 Feb 2019	granted	Deposition ring for a substrate processing chamber

›Other offices — 2 members

Office	Publication	Kind	Published	Filed	Status	Title
TW	TW-D210892-S	S	11 Apr 2021	8 Aug 2019	published	用於基板處理腔室的沉積環zh
TW	TW-D210893-S	S	11 Apr 2021	8 Aug 2019	published	用於基板處理腔室的沉積環zh

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