Semiconductor device

FIG. 1 is a rear perspective view of a semiconductor device showing our new design;

FIG. 2 is a front perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a rear elevation view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a right side view thereof, the left side view thereof being a mirror image.

The dot-dash broken lines represent the bounds of the claimed design, while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design. In addition, the unshaded surfaces in the FIG. 6 view between the solid line edge and the broken lines forms no part of the claimed design.