Ring for a plasma processing apparatus
Granted 28 Jul 2020 · no office action yet
Current assignee: Hitachi High-Tech Instruments Co., Ltd · originally Hitachi, Ltd.
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Attorney: Attorney · Log in to unlock
Inventors: Masakazu Isozaki, Kenetsu Yokogawa, Takao Arase, Taku Iwase +1 · Examiner: Susan Bennett Hattan · AU 2922 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1 is a front, bottom and right…
FIG. 1 is a front, bottom and right side perspective view of a ring for a plasma processing apparatus according to the design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a cross-sectional view taken along line 8 - 8 of FIG. 2 ; and,
FIG. 9 is an enlarged view of the portion shown in BOX 9 in FIG. 8 .
The box labelled as 9 in FIG. 8 is shown in broken lines and forms no part of the claimed design.
Claims
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3 members · 3 offices›IP5 & PCT — 2 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| USthis patent | US-D891636-S | S1 | 28 Jul 2020 | 24 Apr 2019 | granted | Ring for a plasma processing apparatus |
| JP | JP-1640255-S | S | 2 Sep 2019 | 25 Oct 2018 | granted | no title held |
›Other offices — 1 members
| Office | Publication | Kind | Published | Filed | Status | Title |
|---|---|---|---|---|---|---|
| TW | TW-D204229-S | S | 21 Apr 2020 | 24 Apr 2019 | published | 電漿處理裝置用環zh |
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