USPatentGranted
S1

Headphone

Granted 10 Mar 2020 · 2 office actions

Current assignee: Sony Corporation · originally Sony Group Corporation

Law firm: Law firm · Log in to unlock

Attorney: Attorney · Log in to unlock

Inventors: Takayuki Horikiri, Shogo Yashiro, Shunsuke Shiomi · Examiner: Paula Allen Greene · AU 2912 · TC 2900

Application
29/650,768
filed 8 Jun 2018
Publication
Not published
not published
Patent· this page
US D877713
granted 10 Mar 2020

Life of the patent

2 dated events
⤢ drag to zoomJul 2018Oct 2018Jan 2019Apr 2019Jul 2019Oct 2019Jan 2020Apr 2020Prosecution
Prosecutionhover for detail · click to open

Description

1 parts
›FIG. 1 is a front elevational view of…

FIG. 1 is a front elevational view of a first embodiment of a headphone showing our new design;

FIG. 2 is an enlarged right side elevational view of a left side ear cup portion thereof showing the driver cover (partially claimed) behind the mesh screen (in broken lines not-claimed) along the lines 2 - 2 and 2 ′- 2 ′ of FIG. 1 , wherein the driver cover, that covers a driver (not shown) or a diaphragm (not shown), is seen through the hole of the ear pad, in broken lines not claimed, and the mesh screen;

FIG. 3 is an enlarged partial cross sectional view of the left side ear cup portion thereof cut along the line 3 - 3 of FIG. 2 ;

FIG. 4 is another enlarged right side elevational view of a left side ear cup portion thereof showing the driver cover (partially claimed) along the lines 4 - 4 and 4 ′- 4 ′ of FIG. 1 wherein the mesh screen portion of FIG. 2 is removed;

FIG. 5 is an enlarged partial cross sectional view of the left side ear cup portion thereof along the line 5 - 5 of FIG. 4 ;

FIG. 6 is an enlarged front elevational view of a dome shaped driver cover of the headphone of the embodiment of FIG. 1 .

FIG. 7 is a front elevational view of a second embodiment of a headphone showing our new design;

FIG. 8 is an enlarged right side elevational view of a left side ear cup portion thereof showing the driver cover (partially claimed) behind the mesh screen (in broken lines not-claimed) along the lines 8 - 8 and 8 ′- 8 ′ of FIG. 7 , wherein the driver cover is seen through the hole of the ear pad, not claimed, and the mesh screen;

FIG. 9 is an enlarged partial cross sectional view of the left side ear cup portion thereof along the line 9 - 9 of FIG. 8 ;

FIG. 10 is another enlarged right side elevational view of a left side ear cup portion thereof showing the driver cover (partially claimed) along the lines 10 - 10 and 10 ′- 40 ′ of FIG. 7 , wherein the mesh screen portion of FIG. 8 is removed;

FIG. 11 is an enlarged front elevational view of a dome shaped driver cover of the headphone of the embodiment of FIG. 7 .

FIG. 12 is a rear elevational view of the embodiment of FIG. 1 ;

FIG. 13 is a left side elevational view thereof, a right side elevational view thereof being a mirror image; and

FIG. 14 is a top elevational view thereof.

FIG. 15 is a left side elevational view of the embodiment of FIG. 7 , a right side elevational view thereof being a mirror image; and,

FIG. 16 is a top elevational view thereof.

The broken lines illustrating portions of the headphone form no part of the claimed design. The dot-dash broken lines defining the boundaries of the claimed design form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D14/205

Claim changes

Soon
Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

Pendency
1.8 y
641 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Examiner
Paula Allen Greene
art unit 2912 · TC 2900
Citations: 63 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Log in to unlock

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Log in to unlock

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Log in to unlock

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.

Log in to unlock