Headphone
Granted 24 Dec 2019 · 2 office actions
Current assignee: Harman International Industries · originally Samsung Electronics
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Inventors: Derek Campbell, Effrosini A. Karayiannis, Hyo Jin Kim · Examiner: Barbara Fox · AU 2922 · TC 2900
Life of the patent
7 dated eventsDescription
1 parts›FIG. 1 is a perspective view of a…
FIG. 1 is a perspective view of a headphone showing the new design in a first embodiment;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is an opposite side elevational view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view of the headphone in a second embodiment, illustrating a mirror image of the headphone of FIGS. 1-7 ;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a side elevational view thereof;
FIG. 12 is an opposite side elevational view thereof;
FIG. 13 is a top view thereof; and,
FIG. 14 is a bottom view thereof.
The broken lines shown in the drawings depict portions of the headphone that form no part of the claimed design.
Claims
1 · 1 independent · depth 1Classifications
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