USPatentGranted
S1

Polishing pad for substrate polishing apparatus

Granted 9 Jun 2015 · 2 office actions

Application
29/489,180
filed 28 Apr 2014
Publication
Not published
not published
Patent· this page
US D731448
granted 9 Jun 2015

Life of the patent

7 dated events
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Description

1 parts
›FIG. 1 is a top plan view of…

FIG. 1 is a top plan view of a first embodiment of a polishing pad for substrate polishing apparatus, showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front view thereof, the rear view being identical;

FIG. 4 is a right side view thereof, the left side view being identical;

FIG. 5 is an enlarged, top plan view thereof, taken along lines 5 - 5 of FIG. 1 ;

FIG. 6 is an enlarged, cross-sectional view thereof, taken along lines 6 - 6 of FIG. 5 ;

FIG. 7 is a top plan view of a second embodiment of a polishing pad for substrate polishing apparatus, showing our new design;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front view thereof, the rear view being identical;

FIG. 10 is a right side view thereof, the left view being identical;

FIG. 11 is an enlarged, partial top plan view thereof, taken along lines 11 - 11 of FIG. 7 ; and,

FIG. 12 is an enlarged, cross-sectional view thereof, taken along lines 12 - 12 of FIG. 11 .

The dashed-dot-dashed lines represent the boundary lines of the claimed design. The even dashed broken lines depict environment subject matter only and form no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D13/182

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File wrapper

⤢ drag to zoomApr 2014Jul 2014Oct 2014Jan 2015Apr 2015Jul 2015USPTOApplicantNon-final rejectionResponse after non-finalNotice of allowance
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Pendency
1.1 y
407 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Examiner
Elizabeth J Oswecki
art unit 2912 · TC 2900
Citations: 13 back · 0 forward

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Chain of title

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Term & fees

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Validity challenges

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Citations

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