Polishing pad for substrate polishing apparatus
Granted 9 Jun 2015 · 2 office actions
Assignee: Ebara Corporation
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Masaki Kinoshita, Toshifumi Kimba · Examiner: Elizabeth J Oswecki · AU 2912 · TC 2900
Life of the patent
7 dated eventsDescription
1 parts›FIG. 1 is a top plan view of…
FIG. 1 is a top plan view of a first embodiment of a polishing pad for substrate polishing apparatus, showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front view thereof, the rear view being identical;
FIG. 4 is a right side view thereof, the left side view being identical;
FIG. 5 is an enlarged, top plan view thereof, taken along lines 5 - 5 of FIG. 1 ;
FIG. 6 is an enlarged, cross-sectional view thereof, taken along lines 6 - 6 of FIG. 5 ;
FIG. 7 is a top plan view of a second embodiment of a polishing pad for substrate polishing apparatus, showing our new design;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a front view thereof, the rear view being identical;
FIG. 10 is a right side view thereof, the left view being identical;
FIG. 11 is an enlarged, partial top plan view thereof, taken along lines 11 - 11 of FIG. 7 ; and,
FIG. 12 is an enlarged, cross-sectional view thereof, taken along lines 12 - 12 of FIG. 11 .
The dashed-dot-dashed lines represent the boundary lines of the claimed design. The even dashed broken lines depict environment subject matter only and form no part of the claimed design.
Claims
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