Cover of an electronic device having surface ornamentation

The present application is related to copending U.S. patent applications Ser. Nos. 29/425,174, 29/425,175, 29/425,179, 29/425,180, 29/425,182, 29/425,183, 29/425,186, and 29/425,441, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2 .

In FIGS. 1-3 , the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4 , the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4 . The broken lines form no part of the claimed design.