USPatentGranted
S1

Housing for a mobile computing device

Granted 6 Nov 2012 · no office action yet

Current assignee: Qualcomm Technologies, Inc. · originally Hewlett Packard Enterprise

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Inventors: Jason Chamberlain, Richard Gioscia, Philip Bryan, Seungheon Lee +1 · Examiner: Jeffrey D Asch · AU 2916 · TC 2900

Application
29/385,003
filed 7 Feb 2011
Publication
Not published
not published
Patent· this page
US D670259
granted 6 Nov 2012

Life of the patent

10 dated events
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Description

1 parts
›FIG. 1 is a front view of a…

FIG. 1 is a front view of a housing for a mobile computing device;

FIG. 2 is a rear view of a housing for a mobile computing device;

FIG. 3 is a right side view of a housing for a mobile computing device;

FIG. 4 is a left side view of a housing for a mobile computing device;

FIG. 5 is a top end view of a housing for a mobile computing device;

FIG. 6 is a bottom end view of a housing for a mobile computing device;

FIG. 7 is another front view of a housing for a mobile computing device in a closed position;

FIG. 8 is another rear view of a housing for a mobile computing device in a closed position;

FIG. 9 is another right side view of a housing for a mobile computing device in a closed position;

FIG. 10 is another left side view of a housing for a mobile computing device in a closed position;

FIG. 11 is another top end view of a housing for a mobile computing device in a closed position; and,

FIG. 12 is another bottom end view of a housing for a mobile computing device in a closed position.

The broken line showing of the keypad in FIG. 1 is directed to environment and is for illustrative purposes only; the broken lines and the space around the broken lines form no part of the claimed design. The solid line that defines the area in which the broken line keys are shown represent the boundary of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D14/138.AD

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File wrapper

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Pendency
1.7 y
638 days filing → grant
Office actions
0
none on record
Examiner
Jeffrey D Asch
art unit 2916 · TC 2900
Citations: 103 back · 0 forward

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Chain of title

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Citations

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