USPatentGranted
S1

Package for computer cable

Granted 31 Jan 2006 · no office action yet

Assignee: Henry Milan

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Inventors: Henry Milan · Examiner: Stella Reid · AU 2912 · TC 2900

Application
29/189,066
filed 28 Aug 2003
Publication
Not published
not published
Patent· this page
US D513976
granted 31 Jan 2006

Life of the patent

2 dated events
⤢ drag to zoomJul 2003Oct 2003Jan 2004Apr 2004Jul 2004Oct 2004Jan 2005Apr 2005Jul 2005Oct 2005Jan 2006Apr 2006Prosecution
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Description

1 parts
›FIG. 1 is a perspective view disclosing an…

FIG. 1 is a perspective view disclosing an embodiment of a blister package for a computer cable incorporating my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 if a right side elevational view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a top plan view of an alternate embodiment of my design as illustrated in FIGS. 1-6.

The broken line showing in the views is for illustrative purposes only and forms no part of the claimed design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

2 codes
USPC · US Patent Classification
D09/415D94/18

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File wrapper

Pendency
2.4 y
887 days filing → grant
Office actions
0
none on record
Examiner
Stella Reid
art unit 2912 · TC 2900
Citations: 42 back · 0 forward

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Citations

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