Interconnection device
Granted 23 May 2000 · no office action yet
Current assignee: Honeywell Inc. · originally Honeywell International
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Inventors: S. Todd Sanders, Kenneth V. Bechtold, Michael L. Adkins · Examiner: Joel Sincavage · AU 291 · TC 2900
Life of the patent
2 dated eventsDescription
1 parts›FIG. 1, is a top right hand perspective…
FIG. 1, is a top right hand perspective of a first embodiment of the present invention;
FIG. 2 is a top plan view of the first embodiment;
FIG. 3 is a left side elevation of the present embodiment;
FIG. 4 is a front elevation of the first embodiment;
FIG. 5 is a right side elevation of the first embodiment;
FIG. 6 is a back elevation of the first embodiment;
FIG. 7 is a top, right hand perspective of a second embodiment of the present invention;
FIG. 8 is a top plan view of the second embodiment;
FIG. 9 is a front elevation of the second embodiment;
FIG. 10 is a right side elevation of the second embodiment, the left side being a mirror image; and,
FIG. 11 is a back elevation of the second embodiment.
Claims
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