FIG. 1 is a front and upper right perspective view of a configurable multi-product electronics enclosure showing the first embodiment of our new design;

FIG. 2 is a front elevation view of a configurable multi-product electronics enclosure showing the second embodiment our new design. All other plan and elevation views are the same as the first embodiment;

FIG. 3 is a front elevation view of the first embodiment;

FIG. 4 is a front elevation view of a configurable multi-product electronics enclosure showing the third embodiment our new design. All other plan and elevation views are the same as the first embodiment;

FIG. 5 is a is a right side elevation view of the first embodiment, the left side being a mirror image;

FIG. 6 is a is a rear elevation view of the first embodiment;

FIG. 7 is a rear elevation view of a configurable multi-product electronics enclosure showing the fourth embodiment our new design. All other plan and elevation views are the same as the first embodiment;

FIG. 8 is a top plan view of the first embodiment;

FIG. 9 is a bottom plan view of the first embodiment;

FIG. 10 is a rear and upper left perspective view of the first embodiment; and,

FIG. 11 is a rear and upper left perspective view of the fourth embodiment.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1

1 granted claims

›1.independentThe ornamental design for a configurable multi-product electronics enclosure, as shown and described.

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USPC · US Patent Classification

D13/184

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3.8 y

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Joel Sincavage

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