USPatentGranted
S

Packaging assembly

Granted 12 Dec 1995 · no office action yet

Current assignee: Sony Corporation · originally Sony Group Corporation

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Inventors: Yuko Wada · Examiner: Prabhakar G. Deshmukh · AU 292 · TC 2900

Application
Not granted yet
filed 8 Sep 1994
Publication
Not published
not published
Patent· this page
US D365022
granted 12 Dec 1995

Life of the patent

2 dated events
⤢ drag to zoomOct 1994Jan 1995Apr 1995Jul 1995Oct 1995Jan 1996Prosecution
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Description

1 parts
›FIG. 1 is an exploded view of a…

FIG. 1 is an exploded view of a packaging assembly embodying my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a right elevational view thereof, the left elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 7--7 in FIG. 2;

FIG. 8 is a perspective view thereof;

FIG. 9 is an exploded view of an alternate embodiment of my design; and,

FIG. 10 is a perspective view thereof.

The corresponding views of the second embodiment (FIG. 9) are similar to the views of the first embodiment (FIG. 1) FIGS. 2-8 inclusive with the exception of transparent surface.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims

1 · 1 independent · depth 1
1 granted claims

Classifications

1 codes
USPC · US Patent Classification
D09/415

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File wrapper

Pendency
1.3 y
460 days filing → grant
Office actions
0
on the grant's record
Examiner
Prabhakar G. Deshmukh
art unit 292 · TC 2900
Citations: 8 back · 0 forward

Chain of title

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Citations

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