Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500 . The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214 . A DC positive electrode terminal 532 , a DC negative electrode terminal 572 , and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

Claims

9 · 1 independent · depth 3

9 granted claims

›1.independentA semiconductor module, comprising:na first switching device and a first diode that constitute an upper arm of an inverter circuit;a second switching …+8

›2.↳ 1The semiconductor module according to claim 1, whereinnthe first switching device is disposed more distant from the positive electrode terminal than t…d2+1

›4.↳ 1The semiconductor module according to claim 1, whereinnan eddy current caused by an electric current including a recovery current of the first diode o…d2

›5.↳ 1The semiconductor module according to claim 1, whereinnthe third conductor plate has an intermediate electrode so as to be electrically connected to t…d2

›6.↳ 1The semiconductor module according to claim 1, whereinna coolant directly comes into contact with a surface on one side of the pair of heat radiating …d2

›7.↳ 1The semiconductor module according to claim 1,nthe negative electrode terminal and the positive electrode terminal are opposingly disposed.d2

›8.↳ 1A power conversion apparatus comprising a plurality of semiconductor modules according to claim 1, further comprisingna DC bus bar having a DC positiv…d2+1

Classifications

5 codes

IPC · International Patent Classification

Section H — Electricity

H02M7/537
H05K7/20
H05K5/04
H02M7/5387
H01L23/473

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Pendency

3.1 y

1,128 days filing → grant

Office actions

none on record

Examiner

Adolf Berhane

art unit 2838 · TC 2800

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Citations: 45 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20140160821 A1	12 Jun 2014

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