USPatentGranted
B1

Co-mold features on a chassis shell of a mobile device

Granted 15 Nov 2016 · no office action yet

Application
15/140,461
filed 27 Apr 2016
Publication
Not published
not published
Patent· this page
US 9,497,302
granted 15 Nov 2016

Life of the patent

6 dated events
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Abstract

A mobile device can include a unibody component (e.g. chassis shell) with at least a co-mold feature that isolates a contiguous portion of the unibody component from an outer portion of the unibody component. For example, the outer portion and the contiguous portion can be made of an electrically conductive material. The co-mold feature can be made of non-conductive material that electrically isolates the contiguous portion from the outer portion. The co-mold feature can be made by co-molding a resin material in a channel cut into a piece of metal and later exposing the cured resin material on two sides.

Claims

9 · 1 independent · depth 2
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9 granted claims

Classifications

2 codes
IPC · International Patent Classification
Section H — Electricity
  • H04M1/02
  • H04M1/23

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File wrapper

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Pendency
0.6 y
202 days filing → grant
Office actions
0
after a restriction
Examiner
Nam Huynh
art unit 2645 · TC 2600
Citations: 2 back · 0 forward

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Priority chain

1 priority documents
Priority
30 Oct 2015
earliest claimed
›Priority documents — 1
TypeDocumentDate
provisionalUS 6224913030 Oct 2015

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