High density organic bridge device and method

A microelectronic package comprising:nan organic polymer substrate created using a first set of design rules having a first wire width of about 40 μm and first wire spacing of about 40 μm;an organic polymer bridge embedded in the substrate, created using a second set of design rules in at least portion of the organic polymer bridge, the second set of design rules having a second wire width of about 3 μm and a second wire spacing of about 3 μm;a first interconnect structure at a first location of the organic polymer bridge and a second interconnect structure at a second location of the organic polymer bridge; andan electrically conductive path in the organic polymer bridge connecting the first interconnect structure to the second interconnect structure.

An organic bridge adapted to interconnect a plurality of die, the organic bridge comprising:na plurality of metal routing layers;a metal pad layer;at least a portion of the plurality of metal routing layers or at least a portion of the metal pad layer or at least a portion of both adhering to a first set of design rules having a first wire width of about 3 μm and first wire spacing of about 3 μm;interleaved organic polymer dielectric layers between each metal routing layer and the metal pad layer; andwherein there is no layer made substantially of silicon.

A microelectronic package comprising:nan organic polymer package substrate created using a first set of design rules having a first wire width of about 40 μm and first wire spacing of about 40 μm; andan organic polymer bridge created using a second set of design rules in at least a portion of the organic bridge having a second wire width of about 3 μm and a second wire spacing of about 3 μm, the organic polymer bridge comprising a metal pad layer, a metal routing layer and interleaved dielectric layers, the organic polymer bridge being embedded in the organic polymer package substrate.

A method comprising:nproviding an organic bridge comprising:na plurality of metal routing layers;a metal pad layer;at least a portion of the plurality of metal routing layers or at least a portion of the metal pad layer or at least a portion of both adhering to a first set of design rules having a first wire width of about 3 μm and first wire spacing of about 3 μm;interleaved organic polymer dielectric layers between each metal routing layer and the metal pad layer, wherein there is no layer made substantially of silicon;providing an organic package substrate having a recess formed therein; andbonding the organic bridge into the recess of the organic package using an organic polymer.