A packaging method for an OLED device, including: opening at least one through hole in a cover plate in a region between the region for forming glass cement and the region for applying UV glue; regulating the pressure in a cell-assembling chamber to a first pressure, and cell-assembling a back plate with the cover plate placed on a base board in the cell-assembling chamber with the first pressure lower than the atmospheric pressure; regulating the pressure in the cell-assembling chamber to the atmospheric pressure; curing the UV glue; regulating the pressure in the cell-assembling chamber to a second pressure that is lower than the atmospheric pressure and higher than the first pressure and detaching the cover plate from the base board; and sealing the through hole in the cover plate; and sintering the glass cement.

Claims

19 · 1 independent · depth 4

19 granted claims

›1.independentA packaging method for an OLED device, comprising:nopening at least one through hole in a cover plate in a region between a region for forming glass c…+18

›2.↳ 1The packaging method of claim 1, wherein the first pressure is within the range of 2-5 kPa, and the second pressure is within the range of 15-30 kPa.d2+5

›3.↳ 1The packaging method of claim 1, comprising a plurality of through holes, which are uniformly distributed in the region between the UV glue and the gl…d2+1

›5.↳ 1The packaging method of claim 1, wherein a diameter of the through hole is within the range of 0.1-0.2 mm.d2

›6.↳ 1The packaging method of claim 1, wherein the UV glue is cured by ultraviolet rays passing through a light transmitting pattern in a mask plate with th…d2+4

›8.↳ 1The packaging method of claim 1, wherein the glass cement is sintered by laser radiation.d2

›9.↳ 1The packaging method of claim 1, further comprising, after the glass cement having been sintered,ncutting off a section of the OLED cell formed by cel…d2

›10.↳ 1The packaging method of claim 1, wherein the glass cement is formed onto the cover plate around a marginal region of the cover plate by screen printin…d2

›15.↳ 1The packaging method of claim 1, further comprising, after the glass cement having been sintered,ncutting off a section of the OLED cell formed by cel…d2

Classifications

3 codes

IPC · International Patent Classification

Section H — Electricity

H01L51/52
H01L21/447
H01L51/56

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Pendency

0.8 y

279 days filing → grant

Office actions

none on record

Examiner

Mohammad Choudhry

art unit 2816 · TC 2800

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