An encapsulating sheet is formed from an encapsulating resin composition which contains an encapsulating resin and silicone microparticles, and the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %.

Claims

8 · 2 independent · depth 2

8 granted claims

›1.independentAn encapsulating sheet comprising:na release sheet formed from a resin film, andan encapsulating resin layer formed on the release sheet and formed fr…+5

›3.independentAn optical semiconductor element device comprising:nan optical semiconductor element andan encapsulating layer which is formed from an encapsulating s…+1

Classifications

13 codes

IPC · International Patent Classification

Section C — Chemistry; metallurgy

C08G77/16
C08G77/12
C08G77/20
C08K5/5435
C08L83/04
C08K5/56
C08K5/5425
C08G77/04
C08G77/14

Section H — Electricity

H01L23/28
H01L33/56
H01L33/54
H01L33/50

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Pendency

3.5 y

1,278 days filing → grant

Office actions

non-final + final

Responses

1 RCE

Examiner

Mouloucoulaye Inoussa

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20130092973 A1	18 Apr 2013

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