A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Claims

16 · 2 independent · depth 3

16 granted claims

›1.independentA semiconductor light emitting device package, comprising:na first lead electrode;a second lead electrode;at least one light emitting device disposed …+3

›5.independentA semiconductor light emitting device package, comprising:na first lead electrode;a second lead electrode;at least one light emitting device disposed …+11

›6.↳ 5The semiconductor light emitting device package according to claim 5, wherein the at least one of the first lead electrode or the second lead electrod…d2

›7.↳ 5The semiconductor light emitting device package according to claim 5, further comprising:na phosphor layer disposed in the second cavity; anda first w…d2

›8.↳ 5The semiconductor light emitting device package according to claim 5, wherein the first cavity is larger than the second cavity.d2

›9.↳ 5The semiconductor light emitting device package according to claim 5, wherein the recessed portion entirely covers the side surface and the bottom sur…d2

›10.↳ 5The semiconductor light emitting device package according to claim 5, wherein the second lead electrode comprises a first end disposed on the first ca…d2

›11.↳ 5The semiconductor light emitting device package according to claim 5, wherein the package body is disposed on a printed-circuit board (PCB).d2

›12.↳ 5The semiconductor light emitting device package according to claim 5, wherein a lowermost surface of at least one of the first lead electrode or the s…d2

›13.↳ 5The semiconductor light emitting device package according to claim 5, wherein a surface of the resin material comprises a concave shape.d2+1

›15.↳ 5The semiconductor light emitting device package according to claim 5, wherein the package body includes a step portion disposed under the first cavity…d2+1

Classifications

8 codes

IPC · International Patent Classification

Section H — Electricity

H01L33/58
H01L33/50
H01L33/56
H01L33/60
H01L33/38
H01L33/48
H01L33/08
H01L33/62

Claim changes

Soon

Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoom

USPTOApplicanthover for detail · click to open

Pendency

4.8 y

1,771 days filing → grant

Office actions

non-final + final

Responses

3 RCE

Examiner

Marcos D Pizarro

art unit 2814 · TC 2800

Law firm

Law firm · Log in to unlock

Citations: 60 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20110220950 A1	15 Sep 2011

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.