The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.

Claims

16 · 2 independent · depth 2

16 granted claims

›1.independentA semiconductor device comprising:na first substrate with curvature;an adhesive over the first substrate;an oxide layer over the adhesive;a layer comp…+7

›9.independentA semiconductor device comprising:na first substrate with curvature;an adhesive over the first substrate;an oxide layer over the adhesive;a layer comp…+7

Classifications

14 codes

IPC · International Patent Classification

Section G — Physics

G02F1/1333
G02F1/1368

Section H — Electricity

H01L29/66
H01L27/32
H01L51/56
H01L51/00
H01L21/20
H01L29/786
H01L21/683
H01L27/12
H01L27/15
H01L27/28
H01L21/762
H01L21/67

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Pendency

1.0 y

382 days filing → grant

Office actions

none on record

Responses

no RCE

Examiner

Stephen W Smoot

art unit 2813 · TC 2800

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Citations: 327 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20150255615 A1	10 Sep 2015

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