USPatentGranted
B2

Pattern-forming method, and radiation-sensitive composition

Granted 29 Mar 2016 · 2 office actions

Current assignee: JSR CORPORATION · originally JSR Corporation

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Inventors: Hirokazu Sakakibara, Taiichi Furukawa, Koji Ito, Masafumi Hori · Examiner: Amanda C Walke · AU 1722 · TC 1700

Life of the patent

7 dated events
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Abstract

A pattern-forming method includes providing a resist film on a substrate using a radiation-sensitive composition. The resist film is exposed. The exposed resist film is developed using a developer solution. The developer solution includes no less than 80% by mass of an organic solvent. The radiation-sensitive composition includes at least two components including a first polymer and a radiation-sensitive acid generator. The first polymer includes a structural unit having an acid-labile group. One or more components of the radiation-sensitive composition have a group represented by a formula (1). A − represents —N − —SO 2 —R D , —COO − , —O − or —SO 3 − . —SO 3 − does not directly bond to a carbon atom having a fluorine atom. R D represents a linear or branched monovalent hydrocarbon group, or the like. X + represents an onium cation. -A − X +   (1)

Claims

18 · 2 independent · depth 3
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18 granted claims

Classifications

11 codes
IPC · International Patent Classification
Section C — Chemistry; metallurgy
  • C08F220/10
  • C08F220/24
  • C07C381/12
Section G — Physics
  • G03F7/32
  • G03F7/11
  • G03F7/038
  • G03F7/004
  • G03F7/039
  • G03F7/027
  • G03F7/20
  • G03F7/30

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File wrapper

⤢ drag to zoomApr 2015Jul 2015Oct 2015Jan 2016Apr 2016USPTOApplicantNon-final rejectionResponse after non-finalNotice of allowance
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Pendency
1.1 y
389 days filing → grant
Office actions
1
non-final + final
Responses
2
no RCE
Examiner
Amanda C Walke
art unit 1722 · TC 1700
Citations: 83 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20150177616 A125 Jun 2015

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