Moisture resistant polyimide compositions
Granted 29 Mar 2016 · 4 office actions
Current assignee: SHPP Global Technologies B.V. · originally Saudi Basic Industries Corporation
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Attorney: Attorney · Log in to unlock
Inventors: Michael Stephen Donovan, Gurulingamurthy M. Haralur · Examiner: Ana Woodward · AU 1765 · TC 1700
Life of the patent
11 dated eventsAbstract
The invention relates to a moisture resistant composition comprising: a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3′ bisphenol-A dianhydride (BPADA), and 4,4′-diaminodiphenyl sulfone (DDS); b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and c) from 0 to 30 weight percent based on the total weight of the composition of a filler. The invention relates to a reflector substrate comprising a moisture resistant layer metalized with a reflective layer, wherein the moisture resistant layer comprising the moisture resistant composition. The invention relates to a method for producing a metalized coating without a primer comprising applying a reflective layer directly to a moisture resistant layer in the absence of a primer, wherein the moisture resistant layer comprises the moisture resistant composition.
Claims
8 · 1 independent · depth 3Classifications
10 codes- C08J5/22
- C08L79/08
- C08L79/04
- C08L71/10
- C08L71/00
- C08G79/00
- F21V7/22
- F21V7/00
- G02B1/10
- G02B27/00
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20150099134 A1 | 9 Apr 2015 |
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