Printed wiring board

A printed wiring board comprising:nan insulating layer; anda signal layer including a set of at least two signal lines and disposed on one side of the insulating layer,wherein:the insulating layer is provided with a substrate embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is;the insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer;the thick layer is positioned on a side of the substrate over which the signal layer is provided;the thin layer is positioned on an opposite side of the substrate from the side over which the signal layer is provided; anda ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.

A printed wiring board comprising:na first insulating layer;a second insulating layer; anda signal layer including a set of at least two signal lines and interposed between the first insulating layer and the second insulating layer,wherein:the first insulating layer is provided with a first substrate embedded inside the first insulating layer in such a manner to be further from the signal layer than a center of the first insulating layer in a thickness direction of the first insulating layer; andthe second insulating layer is provided with a second substrate embedded inside the second insulating layer in such a manner to be further from the signal layer than a center of the second insulating layer in a thickness direction of the second insulating layer.

A printed wiring board comprising:na first insulating layer;a first signal layer including a set of at least two signal lines;a second insulating layer;a second signal layer including a set of at least two signal lines;a third insulating layer; anda fourth insulating layer,wherein:the first insulating layer, the first signal layer, the second insulating layer, the third insulating layer, the second signal layer, and the fourth insulating layer are stacked in this order;the first insulating layer is provided with a first substrate embedded inside the first insulating layer in such a manner to be further from the first signal layer than a center of the first insulating layer in a thickness direction of the first insulating layer;the second insulating layer is provided with a second substrate embedded inside the second insulating layer in such a manner to be further from the first signal layer than a center of the second insulating layer in a thickness direction of the second insulating layer;the third insulating layer is provided with a third substrate embedded inside the third insulating layer in such a manner to be further from the second signal layer than a center of the third insulating layer in a thickness direction of the third insulating layer; andthe fourth insulating layer is provided with a fourth substrate embedded inside the fourth insulating layer in such a manner to be further from the second signal layer than a center of the fourth insulating layer in a thickness direction of the fourth insulating layer.