Electrostatic chuck, mount plate support, and manufacturing method of electrostatic chuck
Granted 2 Feb 2016 · 2 office actions
Current assignee: Toshiba Memory Corporation · originally Toshiba
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Attorney: Attorney · Log in to unlock
Inventors: Hideo Eto, Makoto Saito, Yasuhiro Nojiri · Examiner: Dharti Patel · AU 2836 · TC 2800
Life of the patent
3 dated eventsAbstract
According to one embodiment, an electrostatic chuck comprises a mount plate, a first layer, and a second layer. The first layer includes a heater. The second layer is provided between the mount plate and the first layer. The second layer transmits heat from the heater to the mount plate. The second layer includes a compressive attachment portion. The compressive attachment portion is formed at the outer edge. The face on the mount plate side of the compressive attachment portion is compressed and attached to the mount plate. The face on the first layer side of the compressive attachment portion is compressed and attached to the first layer.
Claims
18 · 3 independent · depth 4Classifications
4 codes- B32B37/12
- H01T23/00
- H01L21/67
- H01L21/683
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20150043122 A1 | 12 Feb 2015 |
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