USPatentGranted
B2

Electrostatic chuck, mount plate support, and manufacturing method of electrostatic chuck

Granted 2 Feb 2016 · 2 office actions

Current assignee: Toshiba Memory Corporation · originally Toshiba

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Inventors: Hideo Eto, Makoto Saito, Yasuhiro Nojiri · Examiner: Dharti Patel · AU 2836 · TC 2800

Life of the patent

3 dated events
⤢ drag to zoomApr 2014Jul 2014Oct 2014Jan 2015Apr 2015Jul 2015Oct 2015Jan 2016Apr 2016Prosecution
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Abstract

According to one embodiment, an electrostatic chuck comprises a mount plate, a first layer, and a second layer. The first layer includes a heater. The second layer is provided between the mount plate and the first layer. The second layer transmits heat from the heater to the mount plate. The second layer includes a compressive attachment portion. The compressive attachment portion is formed at the outer edge. The face on the mount plate side of the compressive attachment portion is compressed and attached to the mount plate. The face on the first layer side of the compressive attachment portion is compressed and attached to the first layer.

Claims

18 · 3 independent · depth 4
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18 granted claims

Classifications

4 codes
IPC · International Patent Classification
Section B — Performing operations; transporting
  • B32B37/12
Section H — Electricity
  • H01T23/00
  • H01L21/67
  • H01L21/683

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File wrapper

Pendency
1.9 y
698 days filing → grant
Office actions
1
non-final + final
Responses
1
1 RCE
Examiner
Dharti Patel
art unit 2836 · TC 2800
Citations: 13 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20150043122 A112 Feb 2015

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Citations

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