USPatentGranted
B2

Exposure method, substrate stage, exposure apparatus, and device manufacturing method

Granted 12 Jan 2016 · 6 office actions

Current assignee: NIKON CORPORATION · originally Nikon Corporation

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Inventors: Motokatsu Imai, Yoshihiko Kudo, Masahiro Nei, Shigeru Hirukawa +8 · Examiner: Christina Riddle · AU 2882 · TC 2800

Life of the patent

11 dated events
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Abstract

An exposure apparatus exposes a substrate by projecting a pattern image onto the substrate through a liquid. The exposure apparatus includes a projection optical system by which the pattern image is projected onto the substrate, and a movable member which is movable relative to the projection optical system. A liquid-repellent member, at least a part of a surface of which is liquid-repellent, is provided detachably on the movable member, the liquid-repellent member being different from the substrate.

Claims

26 · 1 independent · depth 4
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26 granted claims

Classifications

7 codes
IPC · International Patent Classification
Section G — Physics
  • G03B27/54
  • G03F7/20
  • G03B27/60
  • G03B27/32
  • G03B27/42
  • G03B27/52
  • G03B27/58

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File wrapper

⤢ drag to zoomJan 2013Jul 2013Jan 2014Jul 2014Jan 2015Jul 2015Jan 2016USPTOApplicantNon-final rejectionResponse after non-finalFinal rejectionRequest for continued examinationNon-final rejectionNotice of allowance
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Pendency
2.9 y
1,077 days filing → grant
Office actions
3
non-final + final
Responses
2
1 RCE
Examiner
Christina Riddle
art unit 2882 · TC 2800
Citations: 380 back · 0 forward

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Term & fees

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20130141703 A16 Jun 2013

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Citations

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