Sputtering apparatus

A sputtering apparatus comprising:na process chamber having at least two first regions and a second region, the first regions being regions in which a pre-sputtering process is performed, the second region being a region in which a deposition process is performed, the second region located in a center region of the process chamber and being disposed between the at least two first regions;a metal target located inside the process chamber;a target transfer unit moving the metal target between one of the first regions and the second region and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, the metal target being disposed in a space surrounded by the first shield;a substrate holder disposed in the second region to be capable of facing the metal target, a distance difference between a linear distance, which is a distance between a substrate loaded on the substrate holder and the metal target, and a length of the first shield being 3 cm or less;a loading/unloading port carrying the substrate into and out of the process chamber;a second shield disposed in the first regions, the second shield surrounding a space between the metal target and the substrate holder, the second shield disposed between the loading/unloading port and the space between the metal target and the substrate holder;a first electrode located inside the target transfer unit; anda second electrode located inside the substrate holder, a polarity of voltage applied to the second electrode being different from a polarity of voltage applied to the first electrode.