A method of fabricating an organic electro-luminescence device, the method comprising:nforming a bank layer over a substrate, the bank layer including a first, second, and third portion, the first, second, and third portions formed such that they are at least partially physically separated from each other;forming a first electrode between the first and second portions of the bank layer;forming an auxiliary electrode, at least a part of the auxiliary electrode formed between the second and third portions of the bank layer, the first electrode and the auxiliary electrode formed in contact with a same layer;forming a voltage drop prevention pattern on the auxiliary electrode in between the second and third portions of the bank layer;forming an organic material layer between the first and second portions of the bank layer; andforming a second electrode on the organic material layer, at least a portion of the second electrode electrically coupled to the auxiliary electrode.
›17.↳ 16The method of claim 16, wherein the voltage drop prevention pattern is a negative photoresist.d2
The method of claim 16, wherein the voltage drop prevention pattern is a negative photoresist.
›18.↳ 16The method of claim 16, wherein the voltage drop prevention pattern has an inverse tapered shape.d2
The method of claim 16, wherein the voltage drop prevention pattern has an inverse tapered shape.
›19.↳ 16The method of claim 16, wherein the voltage drop prevention pattern has a top width greater than a bottom width.d2
The method of claim 16, wherein the voltage drop prevention pattern has a top width greater than a bottom width.
›20.↳ 16The method of claim 16, wherein the voltage drop prevention pattern prevents the organic material layer from physically contacting the auxiliary elect…d2
The method of claim 16, wherein the voltage drop prevention pattern prevents the organic material layer from physically contacting the auxiliary electrode while allowing the second electrode to physically and electrically couple to the auxiliary electrode while the organic material layer and the second electrode are formed.
›21.↳ 16The method of claim 16, wherein the organic material layer is formed without physically contacting the auxiliary electrode.d2
The method of claim 16, wherein the organic material layer is formed without physically contacting the auxiliary electrode.
›22.↳ 16The method of claim 16, wherein the second electrode is formed between the voltage drop prevention pattern and the second portion of the bank layer.d2
The method of claim 16, wherein the second electrode is formed between the voltage drop prevention pattern and the second portion of the bank layer.
›23.↳ 16The method of claim 16, wherein the second electrode is formed between the voltage drop prevention pattern and the third portion of the bank layer.d2
The method of claim 16, wherein the second electrode is formed between the voltage drop prevention pattern and the third portion of the bank layer.
›24.↳ 16The method of claim 16, wherein at least a part of the voltage drop prevention pattern is formed between the second and third portions of the bank lay…d2
The method of claim 16, wherein at least a part of the voltage drop prevention pattern is formed between the second and third portions of the bank layer.
›25.↳ 16The method of claim 16, wherein the organic material forms an emission area of the organic electro-luminescence device, and at least a portion of the …d2
The method of claim 16, wherein the organic material forms an emission area of the organic electro-luminescence device, and at least a portion of the voltage drop prevention pattern is formed outside of the emission area.
›26.↳ 16The method of claim 16, wherein an emission area is formed between the first and second portions of the bank layer, and at least a portion of the volt…d2
The method of claim 16, wherein an emission area is formed between the first and second portions of the bank layer, and at least a portion of the voltage drop prevention pattern is formed outside of the emission area.
›27.↳ 16The method of claim 16, wherein a height of the voltage drop prevention pattern is greater than or equal to a height of the second portion of the bank…d2
The method of claim 16, wherein a height of the voltage drop prevention pattern is greater than or equal to a height of the second portion of the bank layer.
›28.↳ 16The method of claim 16, wherein the voltage drop prevention pattern has a double layered inverse tapered shape having a step.d2
The method of claim 16, wherein the voltage drop prevention pattern has a double layered inverse tapered shape having a step.
›29.↳ 16The method of claim 16, further comprising forming a victim pattern at a lower portion of the voltage drop prevention pattern.d2+2
The method of claim 16, further comprising forming a victim pattern at a lower portion of the voltage drop prevention pattern.
›30.↳ 29The method of claim 29, wherein the victim pattern is formed of a material having a different etching selection ratio from at least one of the auxilia…d3+1
The method of claim 29, wherein the victim pattern is formed of a material having a different etching selection ratio from at least one of the auxiliary electrode and the voltage drop prevention pattern.
›31.↳ 30The method of claim 30, wherein the victim pattern comprises at least one of silicon nitride (SiNx), silicon oxide (SiO2), amorphous silicon (a-Si), a…d4
The method of claim 30, wherein the victim pattern comprises at least one of silicon nitride (SiNx), silicon oxide (SiO2), amorphous silicon (a-Si), aluminum (Al), aluminum-neodymium alloy (AlNd), and copper (Cu).
