High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Claims

21 · 3 independent · depth 3

21 granted claims

›1.independentAn LED device comprising:na submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least t…+7

›9.independentA method of assembling a high-density LED device, the method comprising:nfixing at least two groups of LED chips to a submount, a submount comprising …+5

›15.independentAn LED device comprising:na submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least t…+6

Classifications

5 codes

IPC · International Patent Classification

Section H — Electricity

H01L33/62
H01L25/075
H01L33/58

USPC · US Patent Classification

257/99438/28

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Pendency

3.8 y

1,394 days filing → grant

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after a restriction

Responses

2 RCE

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Examiner

Michele Fan

art unit 2823 · TC 2800

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Citations: 54 back · 0 forward

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Priority chain

2 priority documents

Priority

20 Sep 2010

earliest claimed

›Priority documents — 2

Type	Document	Date
provisional	US 61384623	20 Sep 2010
related publication	US 20120068198 A1	22 Mar 2012

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