USPatentGranted
B2

Polyphenylene ether, resin composition, and molded body of resin composition

Granted 21 Oct 2014 · 2 office actions

Life of the patent

7 dated events
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Abstract

The polyphenylene ether according to the present invention includes 5 to 20% by mass of a component having a molecular weight of 50,000 or more and 12 to 30% by mass of a component having a molecular weight of 8,000 or less. The resin composition according to the present invention includes the polyphenylene ether (a) and a hydrogenated block copolymer (b) prepared by hydrogenating a block copolymer including at least two polymer blocks A having a vinyl aromatic compound and at least one polymer block B having a conjugated diene compound, wherein the number average molecular weight (Mnb) of the hydrogenated block copolymer is 100,000 or less, and the number average molecular weight (MnbA) of at least one polymer block of the polymer blocks A is 8,000 or more.

Claims

4 · 1 independent · depth 2
1234
4 granted claims

Classifications

6 codes
IPC · International Patent Classification
Section C — Chemistry; metallurgy
  • C08K5/13
  • C08L23/12
  • C08L53/02
  • C08L77/06
  • C08L77/02
USPC · US Patent Classification
524/323

Claim changes

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File wrapper

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Pendency
4.0 y
1,469 days filing → grant
Office actions
1
non-final + final
Responses
2
no RCE
Examiner
Peter Szekely
art unit 1766 · TC 1700
Citations: 74 back · 0 forward

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Term & fees

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20130231430 A15 Sep 2013

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Citations

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