Device and method for testing semiconductor device
Granted 14 Oct 2014 · 2 office actions
Current assignee: RICOH ELECTRONIC DEVICES CO., LTD. · originally Ricoh Company, Ltd.
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Inventors: Koichi Morino, Kouichi Ikeda · Examiner: Jermele M Hollington · AU 2858 · TC 2800
Life of the patent
3 dated eventsAbstract
A testing method for testing a semiconductor device includes heating the semiconductor device until the temperature of the semiconductor device reaches a predetermined temperature; conducting other functional tests other than testing of the overheat protection function in a second step after the temperature of the semiconductor device has reached the predetermined temperature; allowing the semiconductor device to generate heat by itself such that the overheat protection function of the semiconductor device is activated, detecting a first diode forward voltage of a desired diode contained in the semiconductor device when the overheat protection function of the semiconductor device is activated and computing a first computational temperature of the semiconductor device based on the detected first diode forward voltage of the desired diode contained in the semiconductor device; and determining whether the computed first computational temperature of the semiconductor device resides in the overheat protection function activating temperature range.
Claims
7 · 3 independent · depth 2Classifications
7 codes- G01R31/10
- G01R31/28
- G01R31/02
- H01L35/00
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20120032696 A1 | 9 Feb 2012 |
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