A thin-film transistor forming substrate includes a substrate that has flexibility or elasticity and at least one electronic component that is disposed so as to be buried inside the substrate. The electronic component is configured so as to include one or more types of an IC, a capacitor, a resistor, and an inductor.

Claims

18 · 1 independent · depth 5

18 granted claims

›1.independentA thin-film transistor forming substrate comprising:na substrate that has flexibility or elasticity; anda plurality of electronic components disposed …+17

›2.↳ 1The thin-film transistor forming substrate according to claim 1, wherein the plurality of electronic components includes ICs, and an arrangement gap b…d2

›3.↳ 1The thin-film transistor forming substrate according to claim 1, wherein the plurality of electronic components is configured so as to include at leas…d2

›4.↳ 1The thin-film transistor forming substrate according to claim 1,nwherein the substrate includes a plurality of laminated base members, andeach electro…d2

›5.↳ 1A semiconductor device comprising:na substrate that has flexibility or elasticity; anda semiconductor element that is formed on the substrate,wherein …d2+11

›6.↳ 5The semiconductor device according to claim 5, wherein the semiconductor element is an active element.d3

›7.↳ 5An electric apparatus comprising:na component substrate that has flexibility or elasticity;an opposing substrate, which is arranged so as to face the …d3+9

›8.↳ 7The electric apparatus according to claim 7, wherein the functional element is a display element that has a display unit in which a plurality of pixel…d4

›9.↳ 7The electric apparatus according to claim 7, wherein at least one electronic component is disposed so as to overlap the functional element in the plan…d4

›10.↳ 7The electric apparatus according to claim 7, wherein an external connection electrode connected to the electronic component is disposed on a face of t…d4+2

›13.↳ 7The electric apparatus according to claim 7,nwherein the functional element and the electronic component are connected to each other through a connect…d4

›14.↳ 7The electric apparatus according to claim 7,nwherein a battery cell that is a power supply unit is disposed as the electronic component, andwherein th…d4+1

›16.↳ 7The electric apparatus according to claim 7, wherein the component substrate has moisture-resistance for the functional element.d4

›17.↳ 1The thin-film transistor forming substrate according to claim 1, wherein the arrangement gap between the adjacent electrical components is equal to or…d2

›18.↳ 1The thin-film transistor forming substrate according to claim 1, wherein the plurality of electronic components comprises a plurality of ICs.d2

Classifications

3 codes

IPC · International Patent Classification

Section H — Electricity

H05K1/00

USPC · US Patent Classification

361/749361/765

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2.7 y

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Andargie M Aychillhum

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1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20120140424 A1	7 Jun 2012

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