Optoelectronic semiconductor chip, optoelectronic component and a method for producing an optoelectronic component

An optoelectronic component comprising:nan optoelectronic semiconductor chip comprising a semiconductor body and a metallic, electrically conductive contact layer overlying the semiconductor body, wherein the contact layer has a thickness of less than or equal to 1 μm;a carrier body, wherein the semiconductor chip is disposed on the carrier body so that the contact layer is arranged on a side of the semiconductor body that is remote from the carrier body;an electrically isolating layer, wherein the semiconductor chip and the carrier body are covered at least partly with the electrically isolating layer, wherein the electrically isolating layer has a recess over the metallic, electrically conductive contact layer; andan electrical conductor over the isolating layer, wherein the electrical conductor contacts at least a part of an outer surface of the contact layer and extends laterally away from the semiconductor body, wherein the electrical conductor, as seen from the carrier, is over the electrically isolating layer, a part of the electrical conductor being applied through the recess so that the electrical conductor electrically connects to the metallic, electrically conductive contact layer of the semiconductor body.

A process for producing an optoelectronic component, the process comprising:nproviding a carrier body and an optoelectronic semiconductor chip comprising a semiconductor body and a metallic, electrically conductive contact layer overlying the semiconductor body,applying the semiconductor chip to the carrier body,applying an electrically isolating layer to the semiconductor chip and the carrier body, wherein the electrically isolating layer has a recess over the metallic, electrically conductive contact layer, andapplying electrically conductive material to the isolating layer so that it contacts a contact layer of the semiconductor chip and extends laterally away from the semiconductor chip to form an electrical conductor, wherein a part of the electrical conductor is applied through the recess so that the electrical conductor electrically connects to the metallic, electrically conductive contact layer of the semiconductor body.

A process for producing an optoelectronic component, comprising:nproviding a carrier body and an optoelectronic semiconductor chip,applying the semiconductor chip to the carrier body,applying an electrically isolating layer to the semiconductor chip and the carrier body,applying electrically conductive material to the isolating layer so that it contacts a contact layer of the semiconductor chip and extends laterally away from the semiconductor chip to form an electrical conductor, wherein the application of electrically conductive material comprises an application of a metal layer and a reinforcement of the metal layer by means of galvanic deposition.