Liquid ejection head and liquid ejecting apparatus

The liquid ejection head according to claim 2, wherein the substrate is formed with:nfirst wires passing through portions of the substrate, each located between adjoining first supply ports that are arrayed in the second direction, to connect the energy conversion elements arrayed along the first ejection port array to the first drive circuit; andsecond wires passing through portions of the substrate, each located between adjoining second supply ports that are arrayed in the second direction, to connect the energy conversion elements arrayed along the second ejection port array to the second drive circuit.

The liquid ejection head according to claim 5,nwherein the substrate is a multilayer board,wherein the substrate is formed with:nenergy conversion elements each installed at a position corresponding to a different one of the ejection ports to convert energy for ejecting the liquid;a first drive circuit provided at the opposite side of the first supply ports relative to the third supply ports with respect to the first direction, the first drive circuit being adapted to drive the energy conversion elements arranged along the first ejection port array;a second drive circuit provided at the opposite side of the second supply ports relative to the third supply ports with respect to the first direction, the second drive circuit being adapted to drive the energy conversion elements arranged along the second ejection port array;first wires passing through portions of the substrate, each located between adjoining first supply ports that are arrayed in the second direction, to connect some of the energy conversion elements arrayed along the first ejection port array to the first drive circuit; andsecond wires passing through portions of the substrate, each located between adjoining second supply ports that are arrayed in the second direction, to connect some of the energy conversion elements arrayed along the second ejection port array to the second drive circuit,wherein each of the first and the second wires includes upper and lower wire portions formed in different layers of the substrate, andwherein first through-holes to connect the upper and lower wire portions of the first wires and second through-holes to connect the upper and lower wire portions of the second wires are formed in portions of the substrate, each of the first and second through-holes being located between the two separate supply ports of one of the third supply ports.