Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.

Claims

29 · 4 independent · depth 5

29 granted claims

›1.independentA metal pattern composition comprising:na conductive metal or a conductive metal precursor compound; anda carboxylic acid-amine base ion pair salt,whe…+20

›2.↳ 1The metal pattern composition of claim 1, wherein the conductive metal comprises a Group 3 to Group 12 element, a main group metal, or a combination t…d2+2

›4.↳ 1The metal pattern composition of claim 1, wherein the conductive metal precursor compound is represented by the following Chemical Formula 1:nMlLnXm⬒⬒…d2+2

›5.↳ 1The metal pattern composition of claim 1, wherein the conductive metal or the conductive metal precursor compound has an average largest particle diam…d2

›6.↳ 1The metal pattern composition of claim 1, wherein R1 is represented by the following Chemical Formula 2-1:d2

›7.↳ 1The metal pattern composition of claim 1, wherein at least one of R2 to R4 is represented by the following Chemical Formula 3-1:d2

›8.↳ 1The metal pattern composition of claim 1, wherein the metal pattern composition further comprises about 1 to about 99 weight percent of a metal ion de…d2

›9.↳ 1The metal pattern composition of claim 1, wherein the metal pattern composition comprises about 5 to about 70 weight percent of a metal ion derived fr…d2

›10.↳ 1The metal pattern composition of claim 1, wherein the carboxylic acid-amine base ion pair salt is included in an amount of about 1 weight percent to a…d2

›11.↳ 1The metal pattern composition of claim 1, wherein the carboxylic acid-amine base ion pair salt has a boiling point of about 80 to about 300° C., where…d2

›12.↳ 1The metal pattern composition of claim 1, wherein the metal pattern composition has a viscosity of about 1 to about 100,000 centipoise.d2

›13.↳ 1The metal pattern composition of claim 1, wherein the metal pattern composition further comprises a conductive metal nanoparticle.d2

›14.↳ 1The metal pattern composition of claim 1, wherein the metal pattern composition further comprises an additive, wherein the additive is an adhesive, a …d2

›26.↳ 1The metal pattern composition of claim 1, wherein x in Chemical Formula 2 is 0.d2+3

›15.independentA method of manufacturing a metal pattern composition, the method comprising:ncombining a conductive metal or a conductive metal precursor compound an…

›16.independentA method of manufacturing a metal pattern composition comprising a carboxylic acid-amine base ion pair salt, the method comprising:ncombining a conduc…

›17.independentA method of manufacturing a metal pattern, comprising:npreparing a substrate having a surface; andforming the metal pattern on the surface of the subs…+5

Classifications

11 codes

IPC · International Patent Classification

Section B — Performing operations; transporting

B05D5/12

Section H — Electricity

H01B1/02

USPC · US Patent Classification

252/512427/123252/515106/1.5427/125252/519.3252/514427/126.1252/513

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Pendency

3.6 y

1,313 days filing → grant

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Katie L Hammer

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20110059234 A1	10 Mar 2011

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