USPatentGranted
B2

Device comprising positive hole injection transport layer, method for producing the same and ink for forming positive hole injection transport layer

Granted 18 Mar 2014 · 2 office actions

Assignee: Dai Nippon Printing Co., Ltd.

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Inventors: Shigehiro Ueno, Seiji Take, Yosuke Taguchi, Masato Okada +3 · Examiner: Douglas McGinty · AU 1765 · TC 1700

Life of the patent

10 dated events
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Abstract

The present invention is to provide a device capable of having an easy production process and achieving a long lifetime. A device comprising a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes, wherein the positive hole injection transport layer comprises a transition metal-containing nanoparticle containing at least a transition metal compound including a transition metal oxide, a transition metal and a protecting agent, or at least the transition metal compound including the transition metal oxide, and the protecting agent.

Claims

6 · 2 independent · depth 2
123456
6 granted claims

Classifications

7 codes
IPC · International Patent Classification
Section H — Electricity
  • H01B1/12
USPC · US Patent Classification
252/519.34252/519.3257/40252/515252/512252/519.31

Claim changes

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File wrapper

⤢ drag to zoomApr 2012Jul 2012Oct 2012Jan 2013Apr 2013Jul 2013Oct 2013Jan 2014Apr 2014USPTOApplicantRestriction requirementNon-final rejectionResponse after non-finalNotice of allowance
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Pendency
1.9 y
687 days filing → grant
Office actions
1
after a restriction
Responses
1
no RCE
Interviews
2
examiner interview summaries
Examiner
Douglas McGinty
art unit 1765 · TC 1700
Citations: 31 back · 0 forward

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Term & fees

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20120211705 A123 Aug 2012

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Citations

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