An electronic component analyzing apparatus is provided with a fixing part configured to hold a substrate to which an electronic component is soldered; a gripper configured to grip the electronic component; a transmission part coupled to the gripper, and configured to transmit an external force to the gripper as a force acting in a direction away from the substrate; and a support part configured to pivotally support the transmission part.

Claims

18 · 2 independent · depth 2

18 granted claims

›1.independentAn electronic component analyzing apparatus, said apparatus comprising:na fixing part configured to hold a substrate to which an electronic component …+9

›2.↳ 1The electronic component analyzing apparatus according to claim 1, wherein the gripper is removably provided on the transmission part.d2

›3.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising an adjustment mechanism configured to adjust a support location …d2

›4.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising a guide member configured to slidingly guide the rectilinear mov…d2

›5.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising a first sensor provided in a vicinity of the gripper, and config…d2

›6.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising a second sensor provided on the transmission part, and configure…d2

›7.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising a first adhesion layer provided between a back surface of the el…d2

›8.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising a second adhesion layer provided between a side surface of the e…d2

›9.↳ 1The electronic component analyzing apparatus according to claim 1, further comprising an impact force applying unit configured to generate the externa…d2

›10.↳ 1The electronic component analyzing apparatus according to claim 1, wherein the support part includes a rotation axis which is located on a virtual lin…d2

›11.independentAn electronic component analyzing method, comprising:nholding, with a fixing part, a substrate to which an electronic component is soldered;gripping t…+7

›12.↳ 11The electronic component analyzing method according to claim 11, wherein a support location of the transmission part is adjusted with respect to the f…d2

›13.↳ 11The electronic component analyzing method according to claim 11, wherein the transmission part is slidingly supported by a guide member.d2

›14.↳ 11The electronic component analyzing method according to claim 11, further comprising detecting an acceleration acting on the electronic component using…d2

›15.↳ 11The electronic component analyzing method according to claim 11, further comprising detecting an acceleration caused by the external force using a sec…d2

›16.↳ 11The electronic component analyzing method according to claim 11, further comprising bonding a back surface of the electronic component to the gripper.d2

›17.↳ 11The electronic component analyzing method according to claim 11, further comprising applying an instantaneous impact force from the external force to …d2

›18.↳ 11The electronic component analyzing method according to claim 11, wherein a rotation axis about which the transmission part swings is located on a virt…d2

Classifications

5 codes

IPC · International Patent Classification

Section G — Physics

G01P15/00
G01M7/00

USPC · US Patent Classification

73/514.173/12.973/12.1

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File wrapper

Pendency

2.7 y

972 days filing → grant

Office actions

non-final + final

Responses

no RCE

Examiner

Helen Kwok

art unit 2856 · TC 2800

Law firm

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Citations: 14 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20120017679 A1	26 Jan 2012

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