A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Claims

8 · 1 independent · depth 4

8 granted claims

›1.independentA printed wiring board manufacturing method, comprising:nweaving a glass fiber cloth with warp yarns and weft yarns such that the warp yarns and the w…+7

›2.↳ 1The method according to claim 1, wherein the detecting of the pitch between the warp yarns or between the weft yarns presented in the opening comprise…d2

›3.↳ 1The method according to claim 1, wherein the determining of the pitch between a pair of differential wirings to be patterned comprises determining the…d2

›4.↳ 1The method according to claim 1, further comprising forming the warp yarns and the weft yarns to differ in at least one of a color tone, a shade, and …d2

›5.↳ 1The method according to claim 1, wherein the removing comprises removing the copper foil within the region on the core substrate to form the opening i…d2

›6.↳ 1The method according to claim 1, wherein the removing comprises removing the copper foil within the region on the core substrate to form the opening o…d2+2

Classifications

4 codes

IPC · International Patent Classification

Section H — Electricity

H05K3/02

USPC · US Patent Classification

29/84629/85229/825

Claim changes

Soon

Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoom

USPTOApplicanthover for detail · click to open

Pendency

2.7 y

998 days filing → grant

Office actions

after a restriction

Responses

no RCE

Examiner

Carl Arbes

art unit 3729 · TC 3700

Law firm

Law firm · Log in to unlock

Citations: 15 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20110232949 A1	29 Sep 2011

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.