A laminated chip electronic component comprising:na ceramic body including internal electrodes and dielectric layers;first and second external electrodes formed to cover both end portions of the ceramic body in a length direction;an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance;upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; andadditional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer,wherein when half of a thickness of the ceramic body is defined as A, a thickness of the lower cover layer is defined as B, half of a thickness of the active layer is defined as C, and a thickness of the upper cover layer is defined as D, the thickness (D) of the upper cover layer satisfies a range of D≧4 μm and a ratio (B+C)/A by which a central portion of the active layer deviates from a central portion of the ceramic body satisfies a range of 1.069≦(B+C)/A≦1.763.
›2.↳ 1The laminated chip electronic component of claim 1, wherein a ratio (D/B) of the thickness (D) of the upper cover layer to the thickness (B) of the lo…d2
The laminated chip electronic component of claim 1, wherein a ratio (D/B) of the thickness (D) of the upper cover layer to the thickness (B) of the lower cover layer satisfies 0.018≦D/B≦0.372.
›3.↳ 1The laminated chip electronic component of claim 1, wherein a ratio (B/A) of the thickness (B) of the lover cover layer to the half (A) of the thickne…d2
The laminated chip electronic component of claim 1, wherein a ratio (B/A) of the thickness (B) of the lover cover layer to the half (A) of the thickness of the ceramic body satisfies 0.215≦B/A≦1.553.
›4.↳ 1The laminated chip electronic component of claim 1, wherein a ratio (C/B) of the half (C) of the thickness of the active layer to the thickness (B) of…d2
The laminated chip electronic component of claim 1, wherein a ratio (C/B) of the half (C) of the thickness of the active layer to the thickness (B) of the lower cover layer satisfies 0.135≦C/B≦3.987.
›5.↳ 1The laminated chip electronic component of claim 1, wherein a mark for differentiating upper and lower portions is formed on at least one of upper and…d2
The laminated chip electronic component of claim 1, wherein a mark for differentiating upper and lower portions is formed on at least one of upper and lower surfaces of the ceramic body.
›6.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first array electrode layer formed by laminati…d2
The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first array electrode layer formed by laminating first electrode patterns extending inwardly from the first external electrode in a length direction, while having dielectric layers interposed therebetween, in a thickness direction; anda second array electrode layer formed by laminating second electrode patterns extending inwardly from the second external electrode in the length direction to face the first electrode patterns, while having dielectric layers interposed therebetween, in the thickness direction.
›7.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise floating electrode layers facing the first extern…d2
The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise floating electrode layers facing the first external electrode and second external electrode and laminated in the thickness direction.
›8.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers extend inwardly from the first external electrode or the s…d2
The laminated chip electronic component of claim 1, wherein the additional electrode layers extend inwardly from the first external electrode or the second external electrode in the length direction to face the second external electrode or the first external electrode having a different polarity, and laminated in the thickness direction.
›9.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers are a plurality of floating electrode layers facing the fi…d2
The laminated chip electronic component of claim 1, wherein the additional electrode layers are a plurality of floating electrode layers facing the first external electrode and the second external electrode and laminated in the thickness direction, and the plurality of floating electrode layers face inwardly in the length direction.
›10.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first array electrode layer formed by laminati…d2
The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first array electrode layer formed by laminating first electrode patterns extending inwardly from the first external electrode in the length direction, while having dielectric layers interposed therebetween, in the thickness direction;a second array electrode layer formed by laminating second electrode patterns extending inwardly from the second external electrode in the length direction to face the first electrode patterns, while having dielectric layers interposed therebetween, in the thickness direction; anda floating electrode layer formed between the first array electrode layer and the second array electrode layer and facing the first array electrode layer and the second array electrode layer.
›11.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first electrode pattern and a second electrode…d2+1
The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first electrode pattern and a second electrode pattern extending inwardly from the first external electrode and the second external electrode in the length direction, respectively, and opposed to each other; anda floating electrode pattern disposed in an opposing manner between the first electrode pattern and the second electrode pattern, while having a dielectric layer interposed therebetween.
›12.↳ 11The laminated chip electronic component of claim 11, wherein a gap formed between the first electrode pattern and the second electrode pattern in the …d3
The laminated chip electronic component of claim 11, wherein a gap formed between the first electrode pattern and the second electrode pattern in the length direction has directionality such that the gap is reduced or increased in a lamination direction.
›13.↳ 1The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first electrode pattern and a second electrode…d2
The laminated chip electronic component of claim 1, wherein the additional electrode layers comprise:na first electrode pattern and a second electrode pattern extending inwardly from the first external electrode and the second external electrode in the length direction, respectively, and opposed to each other; anda third electrode pattern and a fourth electrode pattern disposed to face the first electrode pattern and the second electrode pattern, while having a dielectric layer interposed therebetween, and extending inwardly from the first external electrode and the second external electrode in the length direction, respectively, to face each other,wherein a gap between the first electrode pattern and the second electrode pattern in the length direction and a gap between the third electrode pattern and the fourth electrode pattern in the length direction is offset in the lamination direction.
›14.↳ 1A board for mounting a laminated chip electronic component, comprising:na laminated chip electronic component of claim 1;electrode pads electrically c…d2+1
A board for mounting a laminated chip electronic component, comprising:na laminated chip electronic component of claim 1;electrode pads electrically connected to the external electrodes through soldering; anda printed circuit board (PCB) on which the electrode pads are formed and the laminated chip electronic component is mounted on the electrode pads such that the internal electrodes are horizontal and the lower cover layer is disposed in a lower position than the upper cover layer in a thickness direction.
›15.↳ 14The board of claim 14, wherein due to a difference between strain generated in a central portion of the active layer and that generated in the lower c…d3
The board of claim 14, wherein due to a difference between strain generated in a central portion of the active layer and that generated in the lower cover layer as a voltage is applied, a point of inflection (PI) formed at both end portions of the ceramic body in a length direction is formed to be lower than the height of the soldering.
›16.↳ 1A packing unit comprising:na laminated chip electronic component of claim 1; anda packing sheet including a receiving portion for receiving the lamina…d2+5
A packing unit comprising:na laminated chip electronic component of claim 1; anda packing sheet including a receiving portion for receiving the laminated chip electronic component,wherein the internal electrodes are disposed to be aligned horizontally based on a lower surface of the receiving portion.
›17.↳ 16The packing unit of claim 16, further comprising:na packing film coupled to the packing sheet and covering the laminated chip electronic component.d3
The packing unit of claim 16, further comprising:na packing film coupled to the packing sheet and covering the laminated chip electronic component.
›18.↳ 16The packing unit of claim 16, wherein the packing sheet in which the laminated chip electronic component is received is wound as a reel type.d3
The packing unit of claim 16, wherein the packing sheet in which the laminated chip electronic component is received is wound as a reel type.
›19.↳ 16The packing unit of claim 16, wherein each of the laminated chip electronic components received in the receiving portion is disposed such that the low…d3+1
The packing unit of claim 16, wherein each of the laminated chip electronic components received in the receiving portion is disposed such that the lower cover layer thereof faces the lower surface of the receiving portion.
›20.↳ 19The packing unit of claim 19, wherein a mark for differentiating upper and lower portions is formed on an upper surface of the ceramic body.d4
The packing unit of claim 19, wherein a mark for differentiating upper and lower portions is formed on an upper surface of the ceramic body.
›21.↳ 16The packing unit of claim 16, wherein each of the laminated chip electronic components received in the receiving portion has directionality such that …d3
The packing unit of claim 16, wherein each of the laminated chip electronic components received in the receiving portion has directionality such that any one of the upper cover layer and the lower cover layer faces the lower surface of the receiving portion, and a mark is formed on the ceramic body in order to allow the directionality in which any one of the upper cover layer and the lower cover layer faces the lower surface of the receiving portion, to be recognized from the outside.
