USPatentGranted
B2

Nut plate integral epoxy filled sleeve

Granted 4 Jun 2013 · 2 office actions

Life of the patent

9 dated events
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Abstract

A system includes a nut plate and a polymer sleeve passing through the nut plate. The polymer sleeve contains adhesive for attachment of the nut plate to a substrate. The interior of the sleeve includes an epoxy and a catalyzing agent initially separated from one another, but mixed by kneading the sleeve. A portion of the sleeve can be used to apply the adhesive to a bottom surface of the nut plate.

Claims

15 · 2 independent · depth 4
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15 granted claims

Classifications

6 codes
IPC · International Patent Classification
Section F — Mechanical engineering; lighting; heating; weapons
  • F16B39/02
USPC · US Patent Classification
411/82411/82.3411/108411/191411/81

Claim changes

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File wrapper

⤢ drag to zoomJan 2010Jul 2010Jan 2011Jul 2011Jan 2012Jul 2012Jan 2013Jul 2013USPTOApplicantRestriction requirementResponse after non-final
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Pendency
3.4 y
1,260 days filing → grant
Office actions
1
after a restriction
Responses
1
no RCE
Examiner
Roberta Delisle
art unit 3677 · TC 3600
Citations: 26 back · 0 forward

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Term & fees

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Priority chain

2 priority documents
Priority
31 Dec 2008
earliest claimed
›Priority documents — 2
TypeDocumentDate
provisionalUS 6120403731 Dec 2008
related publicationUS 20100166523 A11 Jul 2010

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Citations

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