Semiconductor light emitting device and method for manufacturing the same
Granted 16 Apr 2013 · no office action yet
Current assignee: ALPAD CORPORATION · originally Toshiba
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Inventors: Toshiki Hikosaka, Tomoko Morioka, Hiroshi Ono, Toshiyuki Oka +1 · Examiner: Fazli Erdem
Life of the patent
6 dated eventsAbstract
According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer and a light emitting part. The first semiconductor layer includes an n-type semiconductor layer. The second semiconductor layer includes a p-type semiconductor layer. The light emitting part is provided between the first semiconductor layer and the second semiconductor layer, and includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers. The first semiconductor layer has a first irregularity and a second irregularity. The first irregularity is provided on a first major surface of the first semiconductor layer on an opposite side to the light emitting part. The second irregularity is provided on a bottom face and a top face of the first irregularity, and has a level difference smaller than a level difference between the bottom face and the top face.
Claims
16 · 3 independent · depth 3Classifications
4 codes- H01L33/22
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1 priority documents›Priority documents — 1
| Type | Document | Date |
|---|---|---|
| related publication | US 20120138985 A1 | 7 Jun 2012 |
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