USPatentGranted
B2

Semiconductor light emitting device and method for manufacturing the same

Granted 16 Apr 2013 · no office action yet

Current assignee: ALPAD CORPORATION · originally Toshiba

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Inventors: Toshiki Hikosaka, Tomoko Morioka, Hiroshi Ono, Toshiyuki Oka +1 · Examiner: Fazli Erdem

Life of the patent

6 dated events
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Abstract

According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a second semiconductor layer and a light emitting part. The first semiconductor layer includes an n-type semiconductor layer. The second semiconductor layer includes a p-type semiconductor layer. The light emitting part is provided between the first semiconductor layer and the second semiconductor layer, and includes a plurality of barrier layers and a well layer provided between the plurality of barrier layers. The first semiconductor layer has a first irregularity and a second irregularity. The first irregularity is provided on a first major surface of the first semiconductor layer on an opposite side to the light emitting part. The second irregularity is provided on a bottom face and a top face of the first irregularity, and has a level difference smaller than a level difference between the bottom face and the top face.

Claims

16 · 3 independent · depth 3
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16 granted claims

Classifications

4 codes
IPC · International Patent Classification
Section H — Electricity
  • H01L33/22
USPC · US Patent Classification
257/98257/103257/E33.074

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File wrapper

⤢ drag to zoomJul 2011Oct 2011Jan 2012Apr 2012Jul 2012Oct 2012Jan 2013Apr 2013USPTOApplicantRestriction requirementNotice of allowance
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Pendency
1.7 y
613 days filing → grant
Office actions
0
after a restriction
Examiner
Fazli Erdem
art unit —
Citations: 9 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20120138985 A17 Jun 2012

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Citations

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