USPatentGranted
B2

Plasma generator, plasma control method and method of producing substrate

Granted 16 Apr 2013 · 6 office actions

Current assignee: Akinori Ebe · originally Agency for Science, Technology and Research

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Inventors: Shoji Miyake, Tatsuo Shoji, Akinori Ebe, Yuichi Setsuhara · Examiner: Luz L. Alejandro · AU 1716 · TC 1700

Life of the patent

3 dated events
⤢ drag to zoomJul 2010Jan 2011Jul 2011Jan 2012Jul 2012Jan 2013Prosecution
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Abstract

The present invention aims to provide a plasma generator capable of creating a spatially uniform distribution of high-density plasma. This object is achieved by the following construction. Multiple antennas are located on the sidewall of a vacuum chamber, and a RF power source is connected to three or four antennas in parallel via a plate-shaped conductor. The length of the conductor of each antenna is shorter than the quarter wavelength of the induction electromagnetic wave generated within the vacuum chamber. Setting the length of the conductor of the antenna in such a manner prevents the occurrence of a standing wave and thereby maintains the uniformity of the plasma within the vacuum chamber. In addition, the plate-shaped conductor improves the heat-releasing efficiency, which also contributes to the suppression of the impedance.

Claims

8 · 2 independent · depth 2
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8 granted claims

Classifications

9 codes
IPC · International Patent Classification
Section C — Chemistry; metallurgy
  • C23C15/00
  • C23C16/00
Section H — Electricity
  • H01L21/306
  • H05H1/24
USPC · US Patent Classification
156/345.48216/68427/569118/723.I118/723.AN

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File wrapper

Pendency
2.8 y
1,007 days filing → grant
Office actions
3
non-final + final
Responses
2
1 RCE
Interviews
2
examiner interview summaries
Examiner
Luz L. Alejandro
art unit 1716 · TC 1700
Citations: 63 back · 0 forward

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Priority chain

1 priority documents
›Priority documents — 1
TypeDocumentDate
related publicationUS 20100304046 A12 Dec 2010

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Citations

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