Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment

An enclosure for outside plant equipment, comprising:na base unit;a first printed circuit board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted, and a heat sink connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side;a cover attached to the base unit and having an inside surface covering the enclosure;a second PCB having a circuit side and opposing component side on which electronic components are mounted, said second PCB being supported by the inside surface of the cover, and a heat sink connected to said second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB; anda PCB finger connector interconnecting the first and second PCB's at the component side.

An enclosure for outside plant equipment, comprising:na base unit;a first printed circuit board (PCB) supported by the base unit and having a circuit side and opposing component side on which electronic components are mounted;a cover attached to the base unit and having an inside surface;a second PCB having a circuit side and opposing component side on which electronic components are mounted, said second PCB being supported by the cover at the inside surface, wherein said component sides of said first and second PCB's face each other in opposing relation; anda PCB finger connector interconnecting the first and second PCB's at the component side.

An enclosure for outside plant equipment, comprising:na base unit;a first PCB carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted, and a first heat sink connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side;a second PCB having a circuit side and opposing component side on which electronic components are mounted, and a second heat sink connected to said second circuit board and configured to dissipate heat from any electronic components mounted on the second PCB at the component side; anda PCB finger connector interconnecting the first and second PCB's at the component side.

An enclosure for Outside Plant Equipment, comprising:na base unit of the Outside Plant Equipment;a cover;a first heat sink connected to the base unit;a first printed circuit board (PCB) having a circuit side and opposing component side on which components are mounted, said first PCB secured at the circuit side to the first heat sink mounted to the base unit, wherein said first PCB is configured to transfer heat from the bottom of any component on the component side to the circuit side of the first PCB; andsaid cover includes a second heat sink carried by the cover, a second PCB having a circuit side and opposing component side on which components are mounted, said second PCB secured at the circuit side to said second heat sink carried by the cover, wherein electronic components on the component side of either of the PCB's can be readily accessed; anda PCB finger connector that interconnects both component sides of the first and second PCB's and securing the cover back onto the base unit.