Light emitting device package

A semiconductor light emitting device package, comprising:nmetal layers having at least two lead electrodes, the metal layers disposed to be spaced apart from each other;a semiconductor light emitting device on at least one of the metal layers;a package body having an upper surface, a lower surface, and an opening passing through the upper surface and the lower surface thereof, the semiconductor light emitting device being disposed within the opening, and the opening of the package body having an inclined surface configured to be upwardly broadened, a bottom of the opening being hemmed by a portion of one of the metal layers such that a surface of the portion of the at least one of the metal layers is exposed to outside of the package body; anda molding layer disposed in the opening of the package body,wherein the opening of the package body comprises a first cavity and a second cavity connected to the first cavity,wherein the at least two lead electrodes comprise a second lead electrode extending from the first cavity to the outside of the package body, and a first lead electrode spaced apart from the second lead electrode, the first lead electrode extending to the outside of the package body through the second cavity,wherein the first lead electrode has one end disposed in the first cavity, and a recessed portion disposed in a substantially center portion of the first cavity such as to coincide with the second cavity, andwherein the thickness of the first lead electrode is substantially uniform.

A light unit, comprising:na semiconductor light emitting device package, the semiconductor light emitting device package including:nmetal layers having at least two lead electrodes, the metal layers disposed to be spaced apart from each other;a semiconductor light emitting device on at least one of the metal layers;a package body having an upper surface, a lower surface, and an opening passing through the upper surface and the lower surface thereof, the semiconductor light emitting device being disposed within the opening, and the opening of the package body having an inclined surface configured to be upwardly broadened, a bottom of the opening being hemmed by a portion of one of the metal layers such that a surface of the portion of the at least one of the metal layers is exposed to outside of the package body; anda molding layer disposed in the opening of the package body,wherein the opening of the package body has a substantially flat portion where one end of one of the metal layers is exposed, and another end of one of the metal layers extends to the outside of the package body,wherein, in the semiconductor light emitting device package, the opening of the package body comprises a first cavity and a second cavity connected to the first cavity,wherein the at least two lead electrodes comprise a second lead electrode extending from the first cavity to the outside of the package body, and a first lead electrode spaced apart from the second lead electrode, the first lead electrode extending to the outside of the package body through the second cavity,wherein the first lead electrode has one end disposed in the first cavity, and a recessed portion disposed in a substantially center portion of the first cavity such as to coincide with the second cavity, andwherein the thickness of the first lead electrode is substantially uniform.