A semiconductor module includes: an insulating resin layer; a wiring layer which is provided on one main surface of the insulating resin layer and which includes an external connection region; bump electrodes which are electrically connected to the wiring layer and each of which is formed such that it protrudes from the wiring layer toward the insulating resin layer; a semiconductor device which is provided on the other main surface of the insulating resin layer and which includes device electrodes connected to the bump electrode; and a wiring protection layer provided on the wiring layer and the insulating resin layer so as to expose the external connection region. In the semiconductor module, the outer edge portion of the wiring protection layer is in contact with the external edge portion of the semiconductor device such that it shields at least a part of the semiconductor resin layer at the side edge.

Claims

5 · 1 independent · depth 2

5 granted claims

›1.independentA semiconductor module comprising:nan insulating resin layer;a wiring layer provided on one main surface of the insulating resin layer, and including …+4

Classifications

8 codes

IPC · International Patent Classification

Section H — Electricity

H01L23/48

USPC · US Patent Classification

257/737257/738257/E21.001257/780257/E23.141257/788257/787

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Pendency

2.5 y

928 days filing → grant

Office actions

after a restriction

Responses

no RCE

Examiner

Thanh Nguyen

art unit 2893 · TC 2800

Law firm

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Citations: 2 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20100193946 A1	5 Aug 2010

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