Light emitting device package and method for fabricating the same

A light emitting device package comprising:na package body having a well portion at a bottom surface thereof;a first conductive region formed in the well portion of the package body, the first conductive region having a well portion at a bottom surface thereof;a second conductive region formed in the well portion of the first conductive region, and having a conductivity opposite to a conductivity of the first conductive region;at least one pair of electrodes formed in the package body and electrically connected to the first conductive region or the second conductive region; anda light emitting device installed in the package body and connected to the first and second conductive regions in parallel,wherein the at least one pair of electrodes includes:na front electrode placed on a front surface of the package body; anda rear electrode connected to the front electrode and placed on a rear surface of the package body,wherein the front electrode is directly connected to the rear electrode through a hole,wherein the package body includes a conductive semiconductor, andwherein the first conductive region has a conductivity opposite to a conductivity of the package body.