A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of pins are provided. A device includes at least one projection having a structure in which a surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film.

Claims

8 · 3 independent · depth 2

8 granted claims

›1.independentAn LED board comprising:na wiring; andat least one projection having a structure in which the surface of at least a tip part of a projecting section m…+3

›4.independentA mounting structure comprising at least one device being mounted on an LED board including a wiring and at least one projection, the device including…+1

›5.independentAn electronic device comprising one or a plurality of devices on an LED board,nwherein at least one of the devices includes at least one bump,the boar…+1

Classifications

6 codes

IPC · International Patent Classification

Section H — Electricity

H01L29/22
H01L23/48

USPC · US Patent Classification

257/737257/778257/99257/E23.069

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File wrapper

Pendency

4.5 y

1,638 days filing → grant

Office actions

after a restriction

Responses

3 RCE

Examiner

Nitin Parekh

art unit 2811 · TC 2800

Law firm

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Citations: 13 back · 0 forward

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Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20080017873 A1	24 Jan 2008

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