A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided. A substrate structure 10 comprises a substrate 11 , plural electronic components 12 mounted along one mounting surface 11 A in the substrate 11 , and a resin part 13 for making close contact with the mounting surface 11 A of the substrate 11 while each of the electronic components 12 is covered with a resin 13 A. In the substrate structure 10 , a through hole 14 extending through the substrate 11 in a thickness direction is disposed and also the side of the mounting surface 11 A in the through hole 14 is closed by a lid member 15 . A rising part 21 is disposed in a peripheral part of this lid member 15.

Claims

6 · 1 independent · depth 2

6 granted claims

›1.independentA substrate structure comprising:na substrate having a first surface, a second surface opposite to the first surface;a through hole extends through th…+5

Classifications

8 codes

IPC · International Patent Classification

Section H — Electricity

H05K1/16
H05K1/14

USPC · US Patent Classification

174/260349/150361/761361/749361/760174/254

Claim changes

Soon

Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoom

USPTOApplicanthover for detail · click to open

Pendency

4.6 y

1,698 days filing → grant

Office actions

none on record

Responses

1 RCE

Examiner

Robert J Hoffberg

art unit 2835 · TC 2800

Law firm

Law firm · Log in to unlock

Citations: 14 back · 0 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Priority chain

1 priority documents

›Priority documents — 1

Type	Document	Date
related publication	US 20090032298 A1	5 Feb 2009

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.