An adhesive layer, an insulating layer and a copper foil are laminated together on both surfaces of a metallic base material by way of for example thermal press molding. In this case, openings (window holes) are formed in opposed positions on a portion of the adhesive layer. A circuit pattern is formed by etching on the copper foil in this state, followed by an external shape machining step of executing separation treatment reaching the metallic base material in predetermined positions including the openings. After that, a part of the insulating layer is cut off along the edge of the opening to obtain a circuit board with the end of the metallic base material exposed.

Claims

10 · 2 independent · depth 2

10 granted claims

›1.independentA method of manufacturing a circuit board comprising:na laminating step of laminating adhesive layers on both surfaces of a metallic base material res…+4

›2.↳ 1The method of manufacturing a circuit board according to claim 1, wherein the opening is formed in each of the adhesive layers in the corresponding po…d2

›3.↳ 1The method of manufacturing a circuit board according to claim 1, wherein the portion of the insulating layer which covers the opening formed in the a…d2

›4.↳ 1The method of manufacturing a circuit board according to claim 1, further comprising a cutout part forming step of forming a cutout part on the insula…d2

›5.↳ 1The method of manufacturing a circuit board according to claim 1, wherein the layer conductor is laminated on the insulating layer on each of front an…d2

›6.independentA method of manufacturing a circuit board comprising:na laminating step of forming a mold release mask on a portion of at least one of both surfaces o…+4

›7.↳ 6The method of manufacturing a circuit board according to claim 6, wherein the mold release mask is formed in the corresponding positions of front and …d2

›8.↳ 6The method of manufacturing a circuit board according to claim 6, wherein the portion of the insulating layer is cut off along an edge of the mold rel…d2

›9.↳ 6The method of manufacturing a circuit board according to claim 6, further comprising a cutout part forming step of forming a cutout part on the insula…d2

›10.↳ 6The method of manufacturing a circuit board according to claim 6, wherein the layer conductor is laminated on the insulating layer on each of front an…d2

Classifications

10 codes

IPC · International Patent Classification

Section H — Electricity

H01B13/00

USPC · US Patent Classification

216/20257/698216/37216/67257/77361/794257/438361/735257/729

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3.9 y

1,412 days filing → grant

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Maki A Angadi

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›Priority documents — 1

Type	Document	Date
related publication	US 20080128384 A1	5 Jun 2008

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